JPH0332080Y2 - - Google Patents
Info
- Publication number
- JPH0332080Y2 JPH0332080Y2 JP5752188U JP5752188U JPH0332080Y2 JP H0332080 Y2 JPH0332080 Y2 JP H0332080Y2 JP 5752188 U JP5752188 U JP 5752188U JP 5752188 U JP5752188 U JP 5752188U JP H0332080 Y2 JPH0332080 Y2 JP H0332080Y2
- Authority
- JP
- Japan
- Prior art keywords
- hole
- thin
- film
- thin film
- injection pipe
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000010409 thin film Substances 0.000 claims description 34
- 238000002347 injection Methods 0.000 claims description 24
- 239000007924 injection Substances 0.000 claims description 24
- 239000012530 fluid Substances 0.000 claims description 16
- 238000007789 sealing Methods 0.000 claims description 12
- 239000000758 substrate Substances 0.000 claims description 9
- 239000000853 adhesive Substances 0.000 claims description 8
- 230000001070 adhesive effect Effects 0.000 claims description 8
- 230000001681 protective effect Effects 0.000 claims description 4
- 239000011521 glass Substances 0.000 description 30
- 229920002545 silicone oil Polymers 0.000 description 7
- 239000010408 film Substances 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 3
- 125000006850 spacer group Chemical group 0.000 description 3
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 2
- 230000005684 electric field Effects 0.000 description 2
- 238000005566 electron beam evaporation Methods 0.000 description 2
- 239000005357 flat glass Substances 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- -1 Si 3 N 4 Inorganic materials 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- 229910006404 SnO 2 Inorganic materials 0.000 description 1
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 1
- 229910010413 TiO 2 Inorganic materials 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 239000005388 borosilicate glass Substances 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 238000007872 degassing Methods 0.000 description 1
- 230000032798 delamination Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 230000005283 ground state Effects 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 239000011344 liquid material Substances 0.000 description 1
- 238000004020 luminiscence type Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000000520 microinjection Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000008188 pellet Substances 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 239000005060 rubber Substances 0.000 description 1
- 239000004576 sand Substances 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
- SBIBMFFZSBJNJF-UHFFFAOYSA-N selenium;zinc Chemical compound [Se]=[Zn] SBIBMFFZSBJNJF-UHFFFAOYSA-N 0.000 description 1
- 239000012056 semi-solid material Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 230000003685 thermal hair damage Effects 0.000 description 1
Landscapes
- Electroluminescent Light Sources (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5752188U JPH0332080Y2 (en]) | 1988-04-27 | 1988-04-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5752188U JPH0332080Y2 (en]) | 1988-04-27 | 1988-04-27 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63174195U JPS63174195U (en]) | 1988-11-11 |
| JPH0332080Y2 true JPH0332080Y2 (en]) | 1991-07-08 |
Family
ID=30887304
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5752188U Expired JPH0332080Y2 (en]) | 1988-04-27 | 1988-04-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0332080Y2 (en]) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07105271B2 (ja) * | 1989-05-08 | 1995-11-13 | シャープ株式会社 | 薄膜ｅｌパネルの保護液封止方法 |
| CN105336831A (zh) * | 2015-09-24 | 2016-02-17 | 李峰 | 一种液体填充式led灯 |
-
1988
- 1988-04-27 JP JP5752188U patent/JPH0332080Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63174195U (en]) | 1988-11-11 |
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